LOCTITE® SF 7649 is designed to promote the curing speed of LOCTITE anaerobic adhesives and sealants without any significant loss of joint strength. It is especially recommended for applications with passive metals or inert surfaces and with large bond gaps. LOCTITE SF 7649 offers good performance at low cure temperatures, and is recommended when the application temperature is below 15%deg;C.

• Increases cure speed on passive and inactive surfaces
• For low-temperature curing (< 5%deg;C)
• For large bond gap